BS EN 61190-1-3:2007+A1:2010

Attachment materials for electronic assembly - Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

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Product Details

Descriptors

Soldering

Electronic equipment and components

Particulate materials

Fluxes (materials)

Bars (materials)

Bonding

Electronic engineering

Solders

Pastes

Test methods

Electrical connections

Classification systems

Quality assurance

Quality control

ICS Codes

31.190 Electronic component assemblies

Committee

EPL/501

International relationships

Identical to:

CLC/TR 61340-5-2:2008

EN 61190-1-3:2007/A1:2010

IEC 61190-1-3:2007/AMD1:2010

ISBN

978 0 580 64639 3

Publisher

BSI