Attachment materials for electronic assembly - Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
Published:
•
Withdrawn:
Visit the preview section for more information
Product Details
Descriptors
Soldering
Electronic equipment and components
Particulate materials
Fluxes (materials)
Bars (materials)
Bonding
Electronic engineering
Solders
Pastes
Test methods
Electrical connections
Classification systems
Quality assurance
Quality control
ICS Codes
31.190 Electronic component assemblies
Committee
EPL/501
International relationships
Identical to:
CLC/TR 61340-5-2:2008
EN 61190-1-3:2007/A1:2010
IEC 61190-1-3:2007/AMD1:2010
ISBN
978 0 580 64639 3
Publisher
BSI
BS EN 61190-1-3:2007+A1:2010 | 31 Jul 2007 | BSI Knowledge