BS EN 61190-1-3:2002

Attachment materials for electronic assembly - Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

•

Visit the preview section for more information

Product Details

Descriptors

Quality control

Particulate materials

Quality assurance

Electronic engineering

Soldering

Fluxes (materials)

Electrical connections

Solders

Bonding

Bars (materials)

Electronic equipment and components

ICS Codes

31.190 Electronic component assemblies

Committee

EPL/501

International relationships

Identical to:

EN 61190-1-3 (IEC 61190-1-3:2002 AS)

IEC 61190-1-3:2002

ISBN

0 580 40234 7

Publisher

BSI