BS EN IEC 61190-1-3:2018

What is BS EN IEC 61190‑1‑3 - Attachment materials for an electronic assembly about? 

BS EN IEC 61190‑1‑3 is a quality control standard that discusses attachment materials for electronic assembly. 

BS EN IEC 61190‑1‑3 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders, and solder paste, for electronic soldering applications, and for "special" electronic grade solders. 

Note: BS EN IEC 61190‑1‑3 is not intended to relate directly to the material's performance in the manufacturing process. 

Who is BS EN IEC 61190‑1‑3 - Attachment materials for an electronic assembly for?  

BS EN IEC 61190‑1‑3 on materials for electronic soldering applications is relevant to:  

• Manufacturers of electronic component assemblies 
• Companies involved in the field of electronic engineering  
• Solder product manufacturers, suppliers, and purchasers 
• Quality control and testing authorities 
• Product design engineers 

Why should you use BS EN IEC 61190‑1‑3 - Attachment materials for an electronic assembly?   

In the electronics sector, the soldering technique is used to join components and make one or more electrical connections. Lead-based solders are the most well-known, dependable, and recommended in mission-critical applications including aircraft and medical electronics.  

BS EN IEC 61190‑1‑3 provides guidance on test equipment and inspection facilities of sufficient accuracy, quality, and quantity to permit the performance of the required inspection, along with establishment and maintenance of a calibration system to control the accuracy of the measuring and test equipment. 

Thus, compliance with quality assurance provisions and performance requirements in BS EN IEC 61190‑1‑3 can demonstrate the quality and credibility for your product, thus enhancing value across the supply chain of the product.  

What’s changed since the last update?  

BS EN IEC 61190‑1‑3:2018 supersedes BS EN 61190‑1‑3:2007+A1:2010, which is withdrawn. BS EN IEC 61190‑1‑3:2018 includes the following technical change with respect to BS EN 61190‑1‑3:2007+A1:2010:  

• The maximum impurity level of Pb has been revised and the table of lead-free solder alloys includes some additional lead-free solder alloys