Foreword

ISO (the International Organization for Standardization) is a worldwide federation of national standards bodies (ISO member bodies). The work of preparing International Standards is normally carried out through ISO technical committees. Each member body interested in a subject for which a technical committee has been established has the right to be represented on that committee. International organizations, governmental and non-governmental, in liaison with ISO, also take part in the work. ISO collaborates closely with the International Electrotechnical Commission (IEC) on all matters of electrotechnical standardization.

The procedures used to develop this document and those intended for its further maintenance are described in the ISO/IEC Directives, Part 1. In particular, the different approval criteria needed for the different types of ISO documents should be noted. This document was drafted in accordance with the editorial rules of the ISO/IEC Directives, Part 2 (see www.iso.org/directives).

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This document was prepared by Technical Committee ISO/TC 61, Plastics, Subcommittee SC 5, Physical-chemical properties, in collaboration with the European Committee for Standardization (CEN) Technical Committee CEN/TC 249, Plastics, in accordance with the Agreement on technical cooperation between ISO and CEN (Vienna Agreement).

This third edition cancels and replaces the second edition (ISO 22007‑2:2015), which has been technically revised.

The main changes are as follows:

— Figure 2 has been corrected;
— the term "penetration depth" (former 3.1) has been deleted;
— several Notes have been changed to body text;
— reference has been made in the main text to the theory of sensitivity coefficients.

A list of all parts in the ISO 22007 series can be found on the ISO website.

Any feedback or questions on this document should be directed to the user’s national standards body. A complete listing of these bodies can be found at www.iso.org/members.html.

BS EN ISO 22007-2:2022

Plastics. Determination of thermal conductivity and thermal diffusivity - Transient plane heat source (hot disc) method

Current

Published:

31 Aug 2022