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PD IEC TR 61189-5-506:2019

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - General test methods for materials and assemblies. An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501

Current

•

Published:

31 Jul 2019

Overview
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References
History
Product Details
Descriptors
Test methods
Printing board
Structures
Evaluation
Soldering fluxes
ICS Codes
31.180 Printed circuits and boards
Committee
EPL/501
International relationships
Identical to:

IEC/TR 61189-5-506 Ed.1.0

ISBN
978 0 539 00068 9
Publisher
BSI