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Standard
BS EN IEC 61189-2-804:2023
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Test methods for time to delamination. T260, T288, T300
Current
•
Published:
31 Dec 2023
Overview
Preview
References
History
Product Details
Descriptors
Thermo-mechanical separation
Delamination
Printed-circuit boards
Electrically-conducting materials
Electrical equipment
Testing methods
ICS Codes
31.180 Printed circuits and boards
Committee
EPL/501
International relationships
Identical to:
EN IEC 61189-2-804:2023
IEC 61189-2-804:2023
ISBN
978 0 539 29807 9
Publisher
BSI