FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
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IEC 60749‑5 has been prepared by IEC technical committee 47: Semiconductor devices. It is an International Standard.

This third edition , based on JEDEC document JESD22-A101D.01, cancels and replaces the second edition published in 2017. lt is used with permission of the copyright holder, JEDEC Solid State Technology Association. This edition constitutes a technical revision.

This edition includes the following significant technical changes with respect to the previous edition:

a) the specification of the test equipment is changed to require the need to minimize relative humidity gradients and maximize air flow between semiconductor devices under test;
b) the specification of the test equipment fixtures is changed to require the avoidance of condensation on devices under test and on electrical fixtures connecting the devices to the test equipment;
c) replacement of references to “virtual junction” with “die”.

The text of this International Standard is based on the following documents:

Draft	Report on voting
47/2820/FDIS	47/2827/RVD

Full information on the voting for its approval can be found in the report on voting indicated in the above table.

The language used for the development of this International Standard is English.

This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are described in greater detail at www.iec.ch/publications.

A list of all parts of the IEC 60749 series, under the general title Semiconductor devices - Mechanical and climatic test methods, can be found in the IEC website.

The committee has decided that the contents of this document will remain unchanged until the stability date indicated on the IEC website under webstore.iec.ch in the data related to the specific document. At this date, the document will be

• reconfirmed,
• withdrawn, or
• revised.

BS EN IEC 60749-5:2024

Semiconductor devices. Mechanical and climatic test methods - Steady-state temperature humidity bias life test

Current

Published:

29 Feb 2024