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Standard
BS EN IEC 60749-22-2:2026
Semiconductor devices — Mechanical and climatic test methods - Bond strength — Wire bond shear test methods
Current
•
Published:
31 Jan 2026
Overview
Preview
References
History
Product Details
Descriptors
Climate
Bonding
Electronic equipment and components
Environmental testing
Mechanical testing
Integrated circuits
Strength of materials
Semiconductor devices
ICS Codes
29.100.10 Magnetic components
31.080.01 Semiconductor devices in general
Committee
EPL/47
International relationships
Identical to:
IEC 60749-22-2:2025
EN IEC 60749-22-2 ED1
ISBN
978 0 539 34067 9
Publisher
BSI