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BS EN IEC 60749-22-1:2026

Semiconductor devices — Mechanical and climatic test methods - Bond strength — wire bond pull test methods

Current

•

Published:

31 Jan 2026

Overview
Preview
References
History
Product Details
Descriptors
Semiconductor devices
Strength of materials
Mechanical tests
Integrated circuits
Environmental testing
Electronic equipment and components
Climate
ICS Codes
29.100.10 Magnetic components
31.080.01 Semiconductor devices in general
Committee
EPL/46
International relationships
Identical to:

EN IEC 60749-22-1 ED1

IEC 60749-22-1:2025

ISBN
978 0 539 34038 9
Publisher
BSI